UV Cleaning & Modifying

What is UV Cleaning Surface Modification

UV cleaning surface modification is one of the cleaning surface reformulation methods that improve adhesion and bonding strength by removing organic film on the material surface and hydrophilizing the plastic surface with the energy of short-wavelength UV light emitted from low-pressure mercury lamps and the ozone (O3) generated by the UV light.

Ultraviolet rays emitted from low-pressure mercury lamps used in UV cleaning surface modification equipment have two main wavelengths (184.9 nm and 253.7 nm), and cleaning surface reforming equipment using low-pressure mercury lamps is generally called "UV ozone cleaner," "UV cleaning equipment," "UV surface reforming equipment," etc.

One technology that is often confused is "UV irradiation equipment" that irradiates other wavelengths due to differences in the lamp mechanism, etc.

For example, UV curing equipment using high-pressure mercury lamps with a main wavelength of 365 nm (UV curing and UV drying) and equipment used for sterilization applications with a main wavelength of 254 nm have different structures and applications from "UV cleaning surface modification” .

wavelength range   Use Cases
365nm 矢印アイコン UV curing equipment (UV curing and UV drying)
254nm 矢印アイコン Sterilization and deodorization equipment
308~313nm 矢印アイコン UV irradiation equipment for treatment of skin diseases, etc.
Click here for more information about UV curing equipment

Features of UV cleaning and modification

Dry Cleaning

Compared to wet cleaning, which uses a cleaning solution, UV ozone cleaning does not use chemicals, but uses the energy of ultraviolet rays emitted from low-pressure mercury lamps to improve the cleaning process, making it an environmentally friendly system that can reduce environmental impact.

No damage

Unlike plasma surface reformulation, this process uses only UV light to clean and modify the workpiece surface without damaging it.
In the case of plasma surface reformulation, electrification damage due to ion impact is a serious problem, leading to degradation of the electrical characteristics of the device.
In UV cleaning surface modification treatment, surface treatment by oxygen radicals without plasma discharge is possible.

Low cost due to no need for vacuum facilities

No vacuum chamber, pump, or other vacuum equipment is required, and UV irradiation can be performed at low cost in a general atmospheric pressure environment.

Supports a wide variety of materials

We can provide a combination of low-pressure mercury lamps to match the shape and size of the material.
Currently, light sources in the 184.9nm and 253.7nm wavelength range have not yet been realized using LEDs.
There are many examples of the technology being introduced, for example, in the flat panel manufacturing industry such as LCD and OLED panels.
In addition, the technology has also been introduced in the manufacturing process of automobile parts and smartphone exteriors to improve adhesion and bonding, and to improve wettability for cell cultivation.

Case study

Object/Product Material Applications and effects
  • Flat panel
  • LCD display
  • Plasma display
  • OLED and others
  • Glass
  • Color Filters
  • ITO film
  • Cap glass
  • Removal of organic film on glass surface
  • Improved adhesion between glass and ITO
  • Improved adhesion strength between ITO and insulating film
  • Hydrophilization of various coating films
  • Lead frame
  • IC chip
  • Lasers, etc.
  • Lead fram
  • Silicon wafer
  • Glass wafer
  • Laser Elements
  • Package preprocessing
  • Removal of organic film on wafer surface
  • Removal of organic film on gilding surface, hydrophilization
  • UV ashing of resist
  • Pickup lenses, sensors
  • Lenses for semiconductor manufacturing
  • Single crystal
  • Crystal oscillator, etc.
  • Glass lens
  • Resin Lens
  • Crystal oscillator
  • Ceramic
  • Removal of organic film on lens surface
  • Hydrophilization of resin lens surface
  • Improved adhesion with metallic vapor deposition films
  • Pre-treatment for coating and laminating
  • Printed circuit board
  • Copper substrate
  • Ceramic substrates, etc.
  • Glass epoxy
  • Aluminum oxide (Al2O3)
  • Liquid crystal polymer
  • Pretreatment for plating process
  • Removal of organic matter from resist film surface
  • Improved adhesion to solder
  • Cleaning of modules for nanoimprinting
  • Piezoelectric buzzer
  • Ceramic LSI and others
  • Ceramic
  • Ceramic component deposition pretreatment
  • Improved adhesion of ceramic components
  • Cell phone exterior
  • Connector
  • Switch
  • Automobile interior products, etc.
  • Epoxy
  • Urethane foam
  • Silicon
  • Plastic
  • Improved adhesion between the coating and the resin substrate
  • Improved adhesion between the vapor-deposited film and the resin substrate
  • Improved adhesion between adhesive and resin base material
  • Improved adhesion between fabric and resin base material